3D-IC EDA Challenges

  Any new semi-conductor technology, including 3D-IC, needs three development stages before ramping up its market: (i) Process development, (ii) Pilot product development, and (iii) EDA development. EDA development can be the last stage since process development can be carried out on simple TEG circuits, and the pilot products can be designed by manually drawing figures on section papers while developing the design rules at the same time. However, handy EDA environment is a must before we begin designs in daily bases.

  Current position in the road map may depend on the finer categories of the 3D-IC technologies, and we can roughly summarize as, we are at the middle of the pilot product development. It is the right time to start the EDA development stage today, especially for the most advanced designers, considering the vastness of the EDA challenges.

  The role of the EDA system in 3D-IC design can be addressed as follows.

The EDA system for 3D-ICs is expected to help designers to optimize the net assignments in package IOs and in chip IOs, based on Chip-Package-Board global view, considering the 3D-IC assembly structures and other traditional package structures, while being aware of the SI/PI/thermal and mechanical problems.

  To accomplish the role, we have following EDA challenges.

  • Database issue − New database is needed to represent TSVs and connection using them. It is also hoped to unify the database with traditional package structures, since the designer needs to compare 3D-IC with traditional realizations.
  • FS (Feasibility Study) issue − Convenient light weight tools are needed for model construction, RDL routability analysis, SI/PI/Thermal/Mechanical analysis.
  • DFM (Design For Manufacturability) issue − Steady tools are needed for detailed design, yield improvement, and sign-off simulation.
  • Integration issue − Tight integration of FS/DFM tools is needed.

  The database issue is fundamental to other issues. The FS challenge shall be solved earlier to speed-up the developments of the DFM issue and the integration issue.