GemPackage pays detailed care on the wire bonding design functions. Flexible and intuitive semi-automatic design commands are supported to lay out the bonding pads. Bonding pads can be manually moved around anytime, and reflecting the manual intervention, the automatic buttons works to adjusting spaces between them, aligning them on lines/curves, adjusting angles, etc. Bonding design and interposer design are seamlessly convinced in a non modal way. It is quite easy task in GemPackage to adjust bonding pad layout to rooms for vias. When bonding pads are moved, bonding wires and bendable rats automatically follow the move. Manufacturing checks are provided in detail. One unique example is that, it is possible to inhibit bonding wire flying over a trace inside the resist opened area. Single die, side-by-side multi dies, stacked dies, flip-chip bonding, are all supported.