High density in packaging leads heat problem, then the termal analysis is now an important issue in package design. GemPackage is a handy mean to make 3D model for thermal analysis tool. Currently supported tool is ANSYS Icepak. Package-on-Package (PoP) as well as Chip-Package-Board (CPB) design can be exported to the single model file. The next figure shows the thermal analysis result, for a PoP module in the JEDEC chamber.

  In exporting a model for Icepak, bonding wires, micro bump balls, and solder balls can be merged to reduce the complexity of the model. Gerber files are accompanied to consider patterns and vias on the substrate. The next left figure shows the model just opened by Icepak, and the right figure shows the model after the Gerber files loaded for the two substrates.

  Next step in the analysis tool is to set the material parameters and run calculation. The next left figure is a snapshot of the substrate thermal conductivity distribution considering the patterns and vias. The next right figure is the expected temperature distribution.