GemPackage now exports / imports GDS-II, for feasibility study of RDL designs in WLCSPs. Two layout editors are supported for detailed design. See Compatibility page for more info. We presented the latest version of GemPackage at EDS Fair 2010 booth 315, at Yokohama, Japan. Article "3D-IC FS Flow" is presened. GemPackage now supports 3D-IC, embedded substrate, and WBGA. See Advanced Packages page for more info. We give a talk "Thermal Aware 3D-IC Planning" in Japan ANSYS Conference at Tokyo, Japan. We gave a talk "Current Status of 3D Assembly Design Tool" in the Assembly Technoloogy Workshop at Fukuoka, Japan. GemPackage now exports data to the thermal analysis tool, ANSYS Icepak. See Thermal Issue page for detail. GemPackage now exports data to Ansoft SI/PI simulation tools. See SI/PI page for detail.

"Utilizing Google Earth In Semiconductor Design", Image Lab. Japan Industrial Publishing Co., Ltd. "Gem Design will go Taiwan", Nikkan Kogyo Shimbun. "Gem Design provides low cost EDA tool by utilizing Google Earth etc", Nikkei Business Daily. "Photo Diode Array design tool developed", Semi-conductor News Paper. "Google Earth Used to Design Chips in 3D", Nikkei BP Tech On!