KAWASAKI MICROELECTRONICS, INC. presented their experience in adopting GemPackage in their chip-package co-design flow, at EDS Fair 2011 Nov Seminar (in Japanese).
GemPackage now exports data to a structural analysis tool, ANSYS Mechanical. See Compatibility page for more info.
June 28, 2010
GemPackage now exports / imports GDS-II, for feasibility study of RDL designs in WLCSPs. Two layout editors are supported for detailed design. See Compatibility page for more info.
GemPackage is evaluated good in "3DIC EDA Environment Evaluation Report" , posted at Industrial Development Bureau, Ministry of Economic Affairs, Taiwan. (In Chinese)